? 1 ? e02710-ps sony reserves the right to change products and specifications without prior notice. this information does not convey any licens e by any implication or otherwise under any patents or other right. application circuits shown, if any, are typical examples illustr ating the operation of the devices. sony cannot assume responsibility for any problems arising out of the use of these circuits. CXG1146EN 10 pin vson (plastic) high power sp3t switch with logic control description the CXG1146EN is a high power sp3t switch mmic. this ic can be used in wireless communication systems, for example, w-cdma handsets. the CXG1146EN has on-chip logic for operation with 2 cmos control inputs. the sony's j-fet process is used for low insertion loss and on-chip logic circuit. features ? low insertion loss: 0.35db @1.95ghz, 0.45db @2.14ghz 2 cmos compatible control line small package size: 10-pin vson applications antenna switch for cellular handsets w-cdma structure gaas j-fet mmic absolute maximum ratings (ta = 25c) dc power supply voltage v dd 7v control voltage vctl 5 v operating temperature topr ?35 to +85 c storage temperature tstg ?65 to +150 c gaas mmics are esd sensitive devices. special handling precautions are required. the actual esd measurement data will be available later.
? 2 ? CXG1146EN pin configuration and block diagram 3 6 7 8 9 10 rf2 gnd rf4 gnd rf3 rf1 gnd ctlb v dd ctla 5 4 1 2 f1 gnd gnd f2 f3 pin description pin no. 1 2 3 4 5 6 7 8 9 10 description rf input/output. connect capacitor (recommended value: 100pf) in use. gnd rf input/output. connect capacitor (recommended value: 100pf) in use. gnd rf input/output. connect capacitor (recommended value: 100pf) in use. rf input/output. connect capacitor (recommended value: 100pf) in use. gnd dc power supply logic control b logic control a rf4 gnd rf3 gnd rf2 rf1 gnd v dd ctlb ctla symbol
? 3 ? CXG1146EN recommended circuit truth table f3 off off on f2 off on off f1 on off off ctlb h h l on state rf1 ? rf2 rf1 ? rf3 rf1 ? rf4 3 6 7 8 9 10 rf2 gnd rf4 l1 (15nh) rf3 c rf gnd c rf rf1 gnd v dd 5 4 1 2 ctla cbypass (100pf) rctl (1k ? ) ctlb cbypass (100pf) cbypass (100pf) rctl (1k ? ) gnd gnd f1 f2 f3 item vctl (h) vctl (l) v dd min. 2.0 0 2.5 ty p . 3.0 ? 3.0 max. 3.6 0.4 3.6 unit v v v when using this ic, the following external components should be used: rctl: this resistor is used to improve esd performance. 1k ? is recommended. c rf : this capacitor is used for rf de-coupling and must be used for all applications. cbypass: this capacitor is used for dc line filtering. 100pf is recommended. dc bias condition (ta = 25c) ctla h l h/l state 1 2 3
? 4 ? CXG1146EN electrical characteristics (ta = 25c) unit db db db db db db db db db ? s dbc dbc dbc dbc ma a max. 0.55 0.65 0.65 0.75 1.10 1.20 1.5 5 ?50 ?55 ?55 ?55 0.42 70 ty p. 0.35 0.45 0.45 0.55 0.90 1.00 25 30 30 1.2 1 ?60 ?65 ?80 ?80 0.25 30 min. 20 20 20 condition 1920mhz to 1980mhz ? 1 2110mhz to 2170mhz ? 1 1920mhz to 1980mhz ? 1 2110mhz to 2170mhz ? 1 1920mhz to 1980mhz ? 1 2110mhz to 2170mhz ? 1 rf1 ? rf2, 1920mhz to 2170mhz ? 1 rf1 ? rf3, 1920mhz to 2170mhz ? 1 rf1 ? rf4, 1920mhz to 2170mhz ? 1 50 ? ? 1 ? 2 ? 2 ? 2 ? 2 v dd = 3.0v vctl (h) = 3v state 1 2 3 2, 3 3, 1 1, 2 5mhz 10mhz item insertion loss isolation ? 1 vswr switching speed aclr harmonics bias current control current condition ? 1 pin = 25dbm, 0/3v control, v dd = 3.0v ? 2 pin = 25dbm, 0/3v control, v dd = 3.0v, 1920mhz to 1980mhz, 50 ? note: specification value is one on the ic terminal except for the specific description. symbol il iso. vswr tsw aclr1 aclr2 2fo 3fo i dd ictl rf1 ? rf2 rf1 ? rf3 rf1 ? rf4
? 5 ? CXG1146EN sony corporation package outline unit: mm 0.05 sony code eiaj code jedec code package material lead treatment lead material package mass epoxy resin solder plating copper alloy package structure 10pin vson(plastic) vson-10p-01 0.15 s b a 2.5 2.7 2.5 0.4 b 0.15 s b a 0.05 m s ab x2 x4 s s 0.6 0.5 0.2 0.8 15 6 10 0.35 0.1 0.35 0.1 0.8 ? 0.05 + 0.1 terminal section 0.2 0.01 0.225 0.03 solder plating 0.14 ? 0.03 0.13 0.025 + 0.09 (stand off) 0.03 0.03 pin 1 index 0.013g ranges of 0.1mm and 0.25mm from the end of a terminal. note: 1) the dimensions of the terminal section apply to the lead specifications item lead material copper alloy lead treatment sn-bi 2.5% lead treatment thickness 5-18m spec.
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